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Miss Martina
International Sales Representative

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24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping pictures & photos
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
  • 24 Layer R5775g (HVLP) Back Drilling Board Resin Filling Capping
Structure: Multilayer Rigid PCB
Dielectric: FR-4
Material: R5775g
Application: Communication
Processing Technology: Electrolytic Foil
Production Process: Immersion Gold
Samples:
US$ 0.5/Piece 1 Piece(Min.Order)
| Request Sample
Customization:

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