Custom Made PCB PCBA Aerospace Automotive PCB PCBA Manufacturing

• Customization: Available
• Type: Rigid Circuit Board
• Dielectric: FR-4
• Model NO.: Rigid Circuit Board
• Application: Consumer Electronics
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Aluminum
• Insulation Materials: Epoxy Resin
• Brand: Usun
• Surface Treatment Finish: Enig 2u"
• X-Outs Allowed: No
• Standard: Ipc II
• Delivery: 10 Days
• Transport Package: Bubble Pack + Aluminum Foil Pack
• Specification: 45.72mm*31.26mm
• Trademark: USUN
• Origin: Shenzhen, China
• HS Code: 85340000
• Production Capacity: 70000sqm Per Month
• Package Size: 25.00cm * 25.00cm * 0.16cm
• Package Gross Weight: 2.500kg

Product Description

1. Single, Double side & Multi-layer PCB.
2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole.
3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask,
4. Printed Circuit Boards adhere to IPC Class 2 & 3 international PCB standard.
5. Quantities range from prototype to medium&mass batch production.
6. 100% E-Test.

	Capabilities(Delivery area <5m2)	Capabilities(Delivery area ≥5m2)
Min Pad size for laser drillings	10mil(for 4mil laser via),11mil(for 5mil laser via	10mil(for 4mil laser via),11mil(for 5mil laser via
Min Pad size for mechanical drillings	16mil(8mildiameter)	16mil(8mildiameter)
Min BGA pad size	HASL:10mil,,Lead free min BGA (solder mask 16mil,etching 10mil),  other surface technics are 7mi	HASL:10mil,Lead free min BGA (solder mask 16mil,etching 10mil), flash gold 7 mil,other surface technics are 10mil
Pad size tolerance(BGA)	+/-1.2mil(pad <12mil);+/-10%(pad≥12mil)	+/-1.5mil(pad<10mil);+/-15%(pad≥10mil)
	Capabilities(Delivery area <5m2)	Capabilities(Delivery area ≥5m2)
Min gap between mechanical hole wall and conductor (Local mixed pressure area)	≤10L:14mil;12L:15mil;>12L:18mil	≤10L:14mil;12L:15mil;>12L:18mil
Min gap between mechanical hole wall and the junction of local mixed pressure	≤12L:12mil;>12L:15mil	≤12L:12mil;>12L:15mil
	Capabilities(Delivery area <5m2)	Capabilities(Delivery area ≥5m2)
Max finished copper thickness to internal&external layer	inner Layer:10 OZ;outer layer:11 OZ	inner Layer:4 OZ;outer layer:5 OZ
finished copper thickness to external layer	12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥ 40.4(reference value:40.4-48.5)	12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥40.4 (reference value:40.4-48.5)
	35,50,70μmbase copper:≥55.9;≥70;≥86.7	35,50,70μmbase copper:≥55.9;≥70;≥86.7
	105,140μmbase copper:≥117.6;≥148.5	105,140μmbase copper:≥117.6;≥148.5
Layer count	1-40L	1-20L
PCB thickness	0.20-7.0mm(no solder mask);0.40-7.0mm(with solder mask);	0.3-5.0(no solder mask),0.4-5.0(with solder mask);
PCB thickness tolerance(Normal)	thickness±10%(>1.0mm);±0.1mm(≤1.0mm);	thickness±10%(>1.0mm);±0.1mm(≤1.0mm);
PCB thickness tolerance(Special)	thickness±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm)	thickness±10%(≤2.0mm);±0.15mm(2.1-3.0mm)
Min finished PCB size	10*10mm	50*100mm
Max finished PCB size	24.5*47inch	24*47inch
ionic soil	≤1ug/cm2	≤1ug/cm2
Min bow&twist	0.3%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch)	0.75%
Impedance tolerance	±3Ω(<30Ω),±5%(≥60Ω),±7%(≥45Ω)	±3Ω(<30Ω),±10%(≥30Ω);
Laser blind via size with filling plating	4-5mil(priority4mil)	4-5mil(priority 4mil)
Max aspect ratio for laser via filling plating	1:1(Depth included copper thickness)	1:1(Depth included copper thickness)
Coated copper thickness	min 5μm,	min5μm,
MIN width/space for 0.33OZ base copper	3mil/4mil	3.5mil/4.5mil
MIN width/space for 0.5OZ base copper	3.5mil/4.7mil	3.9mil/5.2mil