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FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Aluminum
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-10 / Piece
Min. Order: 1 Piece
- Structure: Single-Sided Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Delay Pressure Foil
- Base Material: Aluminum
- Insulation Materials: Organic Resin
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Subtractive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Application: Solar Cell
- Batch Number: 2023
- Certification: RoHS, CCC, ISO, EPA
- Manufacturing Technology: Optoelectronic Semiconductor
- Material: Element Semiconductor
- Package: DIP(Dual In-line Package)
FOB Price: US $0.5-9.9 / Piece
Min. Order: 1 Piece
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Base Material: Copper
- Insulation Materials: Epoxy Resin
- Production Process: Enig
- Board Thickness: 1.6mm
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
- Board Thickness: 2mm
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-10 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Base Material: Aluminum
- Insulation Materials: Organic Resin
- Production Process: Immersion Gold
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Structure: Multilayer Rigid PCB
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials
FOB Price: US $0.5-9.9 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Base Material: Copper
- Insulation Materials: Epoxy Resin
- Production Process: Enig
FOB Price: US $0.5-8.8 / Piece
Min. Order: 1 Piece
- Dielectric: Fr-4
- Flame Retardant Properties: V0
- Processing Technology: Electrolytic Foil
- Production Process: Semi-Additive Process
- Base Material: Copper
- Insulation Materials: Metal Composite Materials